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Sponsors and Partners

Speakers

Hidehiko Ishii

First Secretary (Energy, Technology, Industry), Mission of Japan to the European Union

Hidehiko Ishii

First Secretary (Energy, Technology, Industry), Mission of Japan to the European Union

Eva Maydell MEP

EPP lead MEP on Chips Act Package, European Parliament

Jean-Luc di Paola-Galloni

Group Corporate Vice-President Sustainable Development and External Affairs, Valeo

Andreas Kopp

Senior Research Fellow and permanent member of the Investment Committee of the InvestEU Fund, CEPS

Dan Nica MEP

Rapporteur for the EU Chips Act, ITRE Committee, European Parliament

Friederike Berfelde

Associate Brunswick Group

Lucilla Sioli

Director for Artifical Intelligence and Digital Industry DG Connect European Commission

Will Parker

Director of Public Affairs, SEC Newgate EU

Paul Adamson

Chairman, Forum Europe

Sarah Lenczner

Manager Government Affairs EMEA, Qualcomm

Miapetra Kumpula-Natri MEP

Vice-Chair, EU-USA delegation, EU Parliament

Damien Levie

Head of Unit for Technology and Security - FDI Screening, DG TRADE, European Commission

Lars Montelius

Director–General, International Iberian Nanotechnology Laboratory

Jo De Boeck

Executive Vice President and CSO, IMEC

Peter Dröll

Director for Prosperity, DG Research and Innovation, European Commission

Riccardo Masucci

Director of Security and Technology Policy, Intel Corporation

Ilias Chantzos

Global Privacy Officer, Head of EMEA Government Affairs, Broadcom Inc

Robert Troy

Minister of State for Trade Promotion, Digital and Company Regulation, Republic of Ireland

Colette Maloney

Head of Unit A3 - Microelectronics and Photonics Industry, DG Connect

Eva Kaili MEP

Vice President of the European Parliament

Lars Reger

VP and CTO, NXP Netherlands

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